OVERVIEW

The 2026 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT 2026) is the premier forum bringing together leading researchers and industry practitioners in RF, mm-wave, and system-level integration. Hosted in the scenic coastal town of Yehliu, New Taipei City, Taiwan, from August 24-26, 2026, the conference offers cutting-edge sessions on device technologies, packaging, mm-wave and THz systems, and emerging applications from 5G/6G to IoT and automotive radar.

RFIT 2026 welcomes researchers, circuit and system designers, packaging specialists, industry engineers, and junior scholars who are working on RF/microwave/mm-wave front-ends, integration, and systems. Participants will gain insights on state-of-the-art device technologies, packaging strategies, system integration for 5G/6G/IoT, and network with global experts.

IMPORTANT DATES

Paper Submission Deadline

April 15, 2026

Notification of Acceptance

May 20, 2026

Final Manuscript Due

June 20, 2026

Early Bird Registration Deadline

June 30, 2026

Conference Dates

August 24 - 26, 2026

LATEST NEWS

2025.11.10Conference website is now open! 

KEY HIGHLIGHTS

  • Global Technical Program: Invited keynotes, parallel sessions, poster sessions across RFIC, mm-wave, packaging, system integration.
  • Industry-Academia Interface: Exhibitors, sponsorships, and application-oriented tracks linking research to commercialization.
  • Unique Location: Held in Yehliu, New Taipei City — combining conference with scenic local experience.
  • Special Sessions: Emerging B5G/6G Front-Ends, Automotive Radar/Sensing Integration, Heterogeneous Integration, LEO Communications, Wireless Power Transmission, Biomedical and Health care Applications.

SPONSORS

        

Prof. Chiu-Chih Chou / Ms. Yu-Jing Yang
Tel: +886-3-4227151 ext. 34543 or 34510
Fax: +886-3-4272085
Email: rfit2026tw@gmail.com
Copyright © RFIT 2026 All Rights Reserved.